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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL17KGH5D-041A spec no.: ds20-2012-0121effective date: 10/25/2012revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * lead (pb) free product C rohs compliant . * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirement. * popular t - 1 diameter package. package dimensions part no. lens source color ltl17k g h5d - 041a green diffused alingap green notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm(.04") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice. part no. : ltl17k g h5d - 041a page : 1 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25 c parameter maximum rating unit power dissipation 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 90 ma continuous forward current 30 ma derating linear from 50 c 0. 66 ma/ c operating temperature range - 40 c to + 80 c storage temperature range - 55 c to + 100 c lead soldering temperature [2 mm(.0787") from body] 260 c for 5 seconds max. part no. : ltl17kgh5d - 041a page : 2 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at t a =25 c parameter symbol min. typ. max. unit test condition luminous intensity i v 110 180 520 mcd i f = 20ma note 1 viewing angle 2 1/2 - 5 0 - deg note 2 (fig.5) peak emission wavelength p - 574 - nm measurement @peak (fig.1) dominant wavelength d 566 5 71 578 nm note 4 spectral line half - width ? - 1 1 - nm forward voltage v f - 2. 1 2.4 v i f = 20ma reverse c urrent i r - - 100 a v r = 5v , note 5 note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the co lor of the device. 5. r everse voltage (v r ) condition is applied for ir test only. the device is not designed for reverse operation. part no. : ltl17k g h5d - 041a page : 3 of 1 1 bns - od - c131/ a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y typ ical electrical / optical characteristics curves (25 c ambient temperature unless otherwise noted) part no. : ltl17k g h5d - 041a page : 4 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic insertion eq uipment. * most radial lead plastic lead lamps available packaged in tape and reel. * 5mm (0.197") formed lead spacing available. * reel packaging simplifies handling and testing. * ammo packing series lamp type 24 led+gap. package dimensions speci fication item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 4.8 0.188 5.8 0.228 front to rear deflection h -- -- 2.0 0.078 height of seating plane h 15.5 0.610 16.5 0.649 feed hole to bottom of component h1 21.5 0.846 23.5 0.925 feed hole to overall component height h2 26.6 1.047 29.2 1.149 lead length after component height l w0 11.0 0.433 f eed hole pitch p 12.4 0.488 13.0 0.511 lead location p1 3.15 0.124 4.55 0.179 center of component location p2 5.05 0.198 7.65 0.301 total taped thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : ltl17kgh5d - 041a page : 5 of 11 bns - od - c131/a
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y packing spec 3 , 0 00 pcs per inner carton 10 inner cartons per outer carton , total 30, 000 pc s per outer carton in every shipping lot, only the last pack will be non - full packing part no. : ltl17k g h5d - 041a page : 6 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y bin table specification luminous intensity unit : mcd @20ma bin code min. max. fg 110 180 hj 180 310 kl 310 520 note: tolerance of each bin limit is 15% dominant wavelength unit : nm @20ma bin code min. max. h06 566.0 568.0 h07 568.0 570.0 h08 570.0 572.0 h09 572.0 574.0 h10 5 74.0 576.0 h11 576.0 578.0 note: tolerance of each bin limit is 1nm part no. : ltl17k g h5d - 041a page : 7 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinar y electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or m alfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperat ure or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate d esiccant or in desiccators with nitrogen ambient. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads shou ld be bent at a point at least 2 mm fr om the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 5. soldering when soldering, for lamp without stopper type and must be leave a minimum of 2 mm clearance from the base of the lens to the soldering point . to avoided the epoxy climb up on lead frame and was impact to non - soldering problem, dipping the le ns into the solder must be avoided. do not apply any external stress to the lead frame during soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 350 c max. 3 sec. max. (one time only) pre - heat pre - heat time solder wave soldering time 1 0 0c max. 60 sec. max. 260c max. 5 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic fai lure of the led . ir reflow is not suitable process for through hold type led lamp product. part no. : ltl17k g h 5d - 041a page : 8 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current - operated device. in order to ensure intensit y uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circu it model b (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be proper ly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing esd - damage d leeds will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or no light up at low currents. to verify for esd damage, check for light up and vf of the suspect leds at low currents. the vf of good leds should be >2.0v@0.1ma for ingan product and >1.4v@0.1ma for alingap product. part no. : ltl17k g h5d - 041a page : 9 of 1 1 bns - od - c131/a4 chip esd level machine mode l human body mode l i n gan / sapphire 100 v 300 v alingap 200 v 500 v i ngan / sic 600 v 1000 v led led
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dsl? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia - 471 labels on item or pac kaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : ltl17k g h5d - 041a page : 10 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 8 . reliability test classification test item test condition reference standard endurance test operation life ta= under room temper ature as per data sheet maximum rating. * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 750d:1026 (1995) mil - std - 883d:1005 (1991) jis c 7021:b - 1 (1982) high temperature high humidity storage ta= 655c rh= 90 95% test time= 240hrs2hrs mil - std - 202f: 103b(1980) jis c 7021 : b - 11(1982) high temperature storage ta= 1055 c * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 883d:1008 (1991) jis c 7021:b - 10 (1982) low temperature storage ta= - 55 5 c * test time=1000hrs ( - 24hrs,+72hrs) jis c 7021:b - 12 (1982) environmental test temperature cycling 105 c 25 c - 55 c 25 c 30mins 5mins 30mins 5mins 10 cycles mil - std - 202f:107d (1980) mil - std - 750d:1051(1995) mil - std - 883d:1010 (1991) jis c 7021: a - 4(1982) thermal shock 105 5 c - 55 c 5 c 10mins 10mins 10 cycles mil - std - 202f:107d(1980) mil - std - 750d:1051(1995) mil - std - 883d:1011 (1991) solder resistance t.sol = 260 c max. dwell time= 5 secs max. mil - std - 202f: 210a(1980) mil - std - 750d:2031(1995) jis c 7021: a - 1(1982) solderability t. sol = 230 5 c dwell time= 5 1secs mil - std - 202f:208d(1980) mil - std - 750d:2026(1995) mil - std - 883d:2003(1991) jis c 7021: a - 2(1982) 9. others the appearance and sp ecifications of the product may be modified for improvement, without prior notice. part no. : ltl17k g h5d - 041a page : 1 1 of 1 1 bns - od - c131/a4

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